The new CoolFin (37430 Series) heat sinks from Molex Inc. are designed to provide superior cooling for Pentium 4 FMB2 microprocessors at speeds of 3.06 GHz and higher.
The CoolFin heat sink features stamped fins that are linked together and soldered to a base plate. The inner fins, which sit directly above the heat source, are made of copper for maximum thermal efficiency. The outer fins are made of aluminum to reduce weight. CoolFin technology offers a wide range of choices in fin pitch, geometry, material type and thickness, as well as available in multiple fan speeds for motherboards without variable fan-speed technology,
Pricing for Molex’s CoolFin heat sinks depend on quantity; for example, when purchased in quantities of 5,000, the heat sinks would cost $7.78/each.
For more, visit Molex online at www.molex.com.